The heat resistance of phenolic insulation board is excellent.
Firstly, phenolic insulation materials have excellent thermal stability and can be used for a long time in high-temperature environments. Its long-term use temperature can reach 120 ℃, and even when heated to 250 ℃, it will condense and release a small amount of water and trace gases, but it will not cause serious thermal decomposition or combustion. When the temperature further rises to 400 ℃, the material will gradually oxidize and release trace gases, but it will not cause damage to the board. More importantly, when the temperature reaches 600~750 ℃, the phenolic board will carbonize to form carbon black, which actually helps to prevent the further combustion of phenolic foam.
Secondly, phenolic panels have a uniform closed cell structure, which results in a lower thermal conductivity and excellent insulation performance. Compared with polyurethane, its thermal insulation performance is even better than polystyrene foam. This means that phenolic panels perform well in insulation and heat preservation, effectively preventing heat transfer and reducing energy loss.
In addition, phenolic panels also have excellent flame resistance performance. Under the direct action of the flame, a layer of “graphite foam” will be formed on the surface of the phenolic plate, effectively protecting the foam structure in the layer, and the flame penetration resistance time can reach 1 hour. This characteristic allows phenolic panels to maintain stability for a longer period of time in fires, reducing the spread and harm of fires.
In summary, phenolic insulation board has excellent heat resistance performance, which not only maintains stability in high temperature environments, but also has excellent insulation and flame resistance properties. This makes phenolic panels an ideal choice in the field of building insulation, especially suitable for situations that require high heat resistance performance.
Post time: Mar-11-2024