Phenolic board and XPS board are both insulation materials, but they have some differences in terms of manufacturing materials, fire resistance, and insulation performance.
Production material: phenolic board is made of phenolic foam, which is mainly composed of formaldehyde and phenol. It is a fire-resistant insulation material. XPS board is a type of board made from polystyrene resin and other additives, which also has a certain insulation effect.
Fire resistance: The fire resistance rating of phenolic board can reach B1 level, and if it is a composite phenolic board, the fire resistance rating can even reach A2 level. In contrast, XPS board can only achieve a fire resistance rating of B1, so phenolic board has more advantages in fire resistance performance.
Insulation performance: The thermal conductivity of phenolic panels is relatively low, reaching 0.022 or even lower, which makes their insulation performance superior. The thermal conductivity of XPS boards is generally above 0.035, which is slightly inferior in insulation performance.
Application areas: Due to its excellent fire and insulation properties, phenolic panels are widely used in various fields such as construction, cold storage, and pipelines. XPS boards, due to their relatively low fire resistance, may not be suitable for use in certain areas with high fire resistance requirements.
In summary, there are differences between phenolic board and XPS board in terms of manufacturing materials, fire resistance, and insulation performance. In the same scenario, phenolic insulation board has more advantages.
Post time: Mar-06-2024