Phenolic foam, known as the “king of thermal insulation materials”, is a new generation of thermal insulation, fire prevention and sound insulation materials. It is lightweight, fireproof, non burning in case of open fire, smokeless, non-toxic, non dripping, wide range of operating temperatures, non shrinking and non embrittlement in low temperature environments, etc. Because of its high closed cell ratio, phenolic foam has low thermal conductivity, good thermal insulation performance, and certain water resistance and water vapor permeability, which is a good thermal insulation and energy saving material. Phenolic has a benzene ring structure, so its size is stable and its chemical composition is stable. It is anti-corrosion and anti-aging, especially resistant to organic solutions, strong acids and weak alkalis. In the production process of foaming, Freon is not used as a foaming agent, which is harmless to human health and the environment, and meets the national green environmental protection requirements.
Characteristics of phenolic foam board:
1. Excellent fire resistance: Organic insulation materials such as polyurethane and polystyrene can produce thick smoke and highly toxic substances after combustion, which can easily cause death and increase the difficulty of extinguishing fires. The phenolic foam insulation board will not burn in case of fire, and its combustion performance can reach Grade A at most. The maximum use temperature is 180 ℃ (250 ℃ is allowed instantaneously). The 100mm thick phenolic foam insulation board can resist the flame for more than 1 hour without being penetrated. Under the direct action of the flame, it has carbon deposition, no dripping, no curling and no melting. After the flame burns, a layer of flame retardant layer is formed on the surface to effectively protect the foam structure in the layer.
3. Heat resistance: the final cured phenolic foam has a structure consisting of several phenol rings and connected by a nail bridge. Thermodynamics shows that the methylene bridge is one of the most stable connections affected by temperature in organic connection, which makes phenolic foam have excellent thermal stability, which can be used at 120 ℃ for a long time and heat resistant at 200 ℃ for a short time.
Post time: Mar-29-2024